Dome + Dome Spring Probe for IC chipset, OD 0.26~3.50 mm
Crown + Round Spring Probe for IC chipset, OD 0.26~3.50 mm
Crown + Dome Spring Probe for IC chipset, OD 0.26~3.50 mm
Round + Round Spring Probe for IC chipset, OD 0.26~3.50 mm
Dome + Dome Spring Probe for IC chipset, OD 0.26~3.50 mm
Crown + Round Spring Probe for IC chipset, OD 0.26~3.50 mm
Crown + Dome Spring Probe for IC chipset, OD 0.26~3.50 mm
Round + Round Spring Probe for IC chipset, OD 0.26~3.50 mm

Spring Probe, Dual Head, Precision for IC Testing

Spring probe is a core component in IC chip tests, uses springs to achieve reliable electrical connections, tests PCBAs, ICs, semiconductors on performance, function, quality. Beryllium copper with plated gold or silver, Johoty provides perfect custom.

Features:

  • Stable low impedance, accurate testing signals.
  • Wear-resistant, long-lasting, high-frequency, strength.
  • Excellent frequency response and signal integrity.
  • Mechanical reliability and stable contact pressure.
  • Modular design, fits various testing requirements.
  • Eco-friendly, reliable certification for industry standards.

Spring Probe Description

 

Spring Probe, dual head test probe:

 

High precision ± 0.02mm, stable connection <50mΩ, suitable for automated testing of IC chips with a lifespan of up to 500,000 cycles. Supports customization of 12 different plunger tips, with high technical barriers and convenient integration. Controllable delivery time of 2 weeks, complete documentation of CAD/STP/Test Report. Flexible designs concepts and affordable costs facilitate clients’ large-scale deployment and commercial breakthroughs.

Spring Probe Datasheet

 

Parameter Specification Description
Test Probe Diameter φ0.26–φ3.50mm,φ0.30mm,φ2.00mm optional, customizable Compatible with various IC pin pitches
Overall Length 10.00–50.00mm, customizable, Click: more catalog Fits multiple socket dimensions
Working Stroke 0.10–10.00mm, customizable Stable contact, without damaging package
Spring Force 20–150 gf (gram-force),30g, 50g, 80g,   customizable Balances contact integrity & probe life
Contact Resistance ≤ 50mΩ or ≤ 2000mΩ, customizable Clean signal with low resistance
Life Span ≥100,000 cycles, or ≥500,000 cycles, customizable For mass testing and durability
Material Composition BeCu with gold plating, Stainless SWP-B spring High conductivity & mechanical endurance
Minimum Pitch Compatibility ≥0.20mm, customizable, Click: more catalog Fine-pitch BGA, QFN, CSP packages
Operating Temperature -40°C ~ +120°C, customizable Reliable in lab and industries
Mounting Method Vertical, Socket module, Array supported, customizable Integrated into existing ATE/IC setups

Get a Free Quote for Spring Probe

Choosing Johoty’s spring probe will give you high precision, long life cycles, stable performance. We focus on IC chip tests, provide cost-effective solutions for maximum efficiency & minimum costs.

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Applications of Spring Probe

Test Fixtures with Test Probe Ensure Best Test Accuracy, Ultimate, Spring Probe

 

High speed chip ATE automated testing: Suitable for connecting fully automated ATE testing machines for high-speed chips such as SoC, CPU, FPGA, etc., ensuring high signal integrity and low contact impedance.

Wafer level IC detection testing: can be used for signal contact pins in the development of 12 inch wafer testing probe cards, meeting nanometer level flatness requirements.

Post packaging functional testing: During the functional verification stage of QFN, BGA, and other packaged products, achieve precise and reliable multi PIN docking.

High frequency RF chip testing: for millimeter wave, WiFi 6E, 5G RF front-end chips, supporting high-frequency transmission above 50GHz.

Microcurrent/Low Leakage IC Testing: Suitable for precision analog-to-digital/digital analog chips, operational amplifiers, and other microcurrent applications, with elastic compensation to ensure zero loss measurement.

MEMS/Sensor IC Testing: Suitable for electrical performance interface testing of MEMS packaging modules such as pressure, acceleration, gyroscope, etc.

Multi Chip Module (MCM) Joint Testing Solution: Addressing the high-density concurrent contact requirements in MCM multi chip joint testing.

High density testing fixture development: used for customized connections with high pin count and high arrangement density in probe cards and split board testing fixtures.

Quick validation board interface optimization: used for fast switching between the debugging board and DUT during the Bench Test phase to improve prototype validation efficiency.

Smart wearable chip verification: Package level testing scenarios that match miniaturized, ultra-low power chips, suitable for TWS, wristbands, and AR chips.

Automotive chip reliability testing: Package level interface testing for high temperature and high pressure environments, meeting AEC-Q100 reliability verification.

Large-scale shipment workstation port: suitable for low-cost and high durability scenarios such as batch IC burning, screening, yield testing, etc. on production lines.

 

Click:  More Catalog

 

Mechanical Drawing of Spring Probe
More Information

Johoty’s Services of Spring Probe

 

Spring Probe custom prototyping: Fast response, completed within 2 weeks. Support small batches of diversified samples to ensure accurate verification of design schemes. Support dual verification of structure/electrical properties to quickly identify the best testing solution.

 

Quality assurance system: using high-purity gold-plated contact pins and industrial grade wear-resistant and corrosion-resistant materials. Supports lifespan testing >300,000 times, with a machining tolerance of ± 2μm, in compliance with ISO 9001 and IPC. 100% electrical performance testing and mechanical life verification for each batch, with a stability of up to 99.99%.

 

Delivery commitment: Standard orders will be delivered within 2 weeks, and urgent orders will be shipped within 5-7 days at the earliest. The exclusive production line ensures stable delivery time and no risk of delay. The full process ERP+MES digital system control meets engineering prototype as well as mass production.

 

Minimum Order Quantity (MOQ): Supports sample and small batch orders, with MOQ as low as 100pcs. Reduce customer inventory pressure, support mixed ordering of multiple specifications, and flexibly match project schedules.

 

Logistics plan: default air transport of DHL, FedEx, UPS, TNT. Real-time tracking ensures safe and fast delivery of spring probe. Provide dedicated logistics and door-to-door services for bulk orders.

 

Exclusive liaison qualification: With an industry average of 10 years or more of testing engineering background, FAE directly connects with customers. Full process technical consultant and sales manager provide one-on-one service, with backgrounds covering IC testing engineers and supply chain experts. Having a deep technical understanding and the ability to respond quickly to problems, ensuring efficient and accurate communication.

 

Immediate response: respond to emails and arrange online technical docking within 12 hours, and provide complete solutions and quotations within 2 days.

 

Click:  More Catalog

 

Check Material Top Key Procedures for Pogo Pin Production, Spring Probe, Proven

 

Performance Test of Spring Probe

 

High reliability contact consistency: Contact resistance ≤50mΩ, fluctuation<5% after 100,000 insertions and removals, and stable test data Adapt to ATE and high-speed probe card environments.

 

Extreme macro precision capture: The dual head design supports a minimum pitch of 0.15mm, making it easy to handle advanced packaging with fine spacing such as BGA/CSP/SIP.

 

RF level low crosstalk performance: Through S-parameter testing in the 5GHz~10GHz frequency band, ensure high-speed signal integrity and interference-free connection.

 

Durable life up to 300,000 cycles: precision beryllium copper + gold coating combination, passed elasticity and fatigue resistance tests within the range of 5g~150g, long-lasting and stable without interruption.

 

Compatible with multiple testing platforms: Handler/Socket/ATE/Load Board, fast integration, and on-site verification pass rate >99.8%.

 

No virtual soldering or false connections: Each needle undergoes 100% factory impedance scanning and elasticity mean screening, and the batch qualification rate is controlled within the Six Sigma standard.

 

Click:  More Catalog

 

Check Material Top Key Procedures for Pogo Pin Production, Amazing, Spring Probe

 

Customization of Johoty’s Spring Probe

 

Full specification deep customization: supports full range customization of 0.15mm-2.54mm spacing, accurately adapts to high-density BGA, QFN, WLCSP and other packaging structures.

 

Customer structure diagram or engineering solution: Provide customized structure review diagram within 24 hours, sample delivery within 15 days, and compress NPI cycle by more than 50%.

 

High elasticity/low elasticity/RF/high current full type support: customized stroke, preloading, elasticity, current, contact impedance, coating and needle tip structure. Implement a multifunctional platform integrated solution.

 

Cross platform one-to-one customization: compatible with mainstream ATE and probe card platforms such as Advantest, Teradyne, Chroma, and Cohu, ensuring full process fit.

 

Batch consistency control <± 3%: The fully customized solution is validated through structural simulation and process pre validation, with minimal batch deviation, ensuring stable and error free batch import.

 

Flexible minimum order, fast delivery: Small batch minimum order of 100pcs, 15 day delivery, fast trial production verification, dedicated project manager to follow up the entire process.

 

Click:  More Catalog

 

Mass Production Of Pogo Pin To Cut Cost For Your Project, Reliable, spring probe

 

FAQ

 

What package types does spring probe support for IC testing? It fully supports advanced packages such as WLCSP, BGA, QFN, CSP, LGA, etc., and can adapt to a minimum spacing of 0.15mm.

 

How many times can spring probe withstand plug and unplug lifespan? Structural optimization supports stable plug and unplug of over 3 million times, suitable for high-frequency production verification and ATE automation platforms.

 

Can spring probes be customized for specific elasticity, length, contact impedance, coating or tip structure? Supports full dimensional customization, with an elasticity range of 5g~150g, precise control of needle length ± 0.05mm, contact impedance ≥ 10mΩ, and optional gold/nickel/rhodium multi-layer coating.

 

Has the spring probe been validated through high-frequency and high current testing? It has passed the S parameter/RF consistency verification above 5GHz, and can support a maximum current of 10A. It has also passed UL arc resistance and thermal stability testing.

 

What is MOQ and delivery cycle for spring probes? fastest sample delivery in 10 days, minimum order quantity of 100pcs, batch delivery in 15 days for fast R&D.

 

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